Die-bonding machine for FPCB COB strip light making machine
LED roll Crystal fixing machine |
Model | GTS80A |
System |
production cycle | 90ms(周期取决于晶片尺寸及支架) |
XY accuracy | ±1mil(±0.025mm) |
chip rotation | ±3° |
Chip XY work table |
chip size | 3mil*3mil-80mil*80mil(0.076mm*0.076mm-2mm*2mm) |
resolution ration | 0.04mil(1μm) |
chip maximum angle correction | ±15° |
max chip ring size | 6″（152mm）(External Diameter) |
max chip area | 4.7″（119mm）(Expanded) |
Thimble Z height stroke | 80mil（2mm） |
Image recognize system |
Gray scale | 256 degrees grey |
resolution ration | 656*492 pixels |
image recognize accuracy | ±0.025mil@50mil observation range |
Crystal absorbing swing arm robotic hand system |
Crystal absorbing swing arm | 90°rotatable solid crystal |
Crystal absorbing pressure | 30g-250g can be adjusted |
Feeding work table |
travel area | / |
XY resolution ration | 0.02mil(0.5μm) |
Suitable bracket size |
length of bracket | / |
width of bracket | Max 120mm |
Required facilities |
Power | 220V AC±5%/50HZ |
Air pressure | 0.5MPa（MIN） |
Rated power | 1600W |
Gas consumption | 40L/min |
Dimension & weight |
L*W*H | 189*100*175cm |
Weight | 1300kg |
Keywords: COB machine, bonding machine, bonder machine, COB bonding machines, FPCB COB bonder, roll to roll bonding machine, roll to roll bonder machine
