chip on board resistance bonding machines for roll to roll FPCB

COB resistance bonding machines for roll to roll FPCB

LED Resistance machine
Model	GTS80T
System
production cycle	42K/h (cycle time is depended on the chip size and bracket)
XY accuracy	±1mil(±0.025mm)
Chip XY work area
chip size	3mil3mil-80mil80mil(0.076mm0.076mm-2mm2mm)
resolution ration	1μm
Image recognize system
Gray scale	256 degree
resolution ration	656*492 pixel
image recognize accuracy	±0.025mil@50mil observation range
Crystal absorbing robotic hand system
Crystal absorbing swing arm	90°rotatable solid crystal
Crystal absorbing pressure	30g-250g can be adjusted.
Feeding work table
travel range	/
XY resolution ration	0.02mil(0.5μm)
Suitable bracket size
length of bracket	/
width of bracket	120mm(normal roll PCB width)
Required facilities
Power	220V AC±5%/50HZ
Air source	0.5MPa（MIN）
Rated power	1200W
Gas consumption	40L/min
Volume and Weight
LWH	180100175cm
weight	1300kg

Chip on board resistance bonding machines for roll to roll FPCB